深圳斯普瑞溙科技有限公司是一家從事半導體后道封裝測試貼片及邦定工藝相關耗材、測試工藝耗材及治具、封裝測試設備備件的研發(fā)設計、生產、銷售于一體的企業(yè)。公司成立于2009年。公司擁有一個半導體制造技術經驗豐富的團隊，不定期地與國外進行技術交流，不斷地進行新技術、新工藝的開發(fā)和改進，使公司在半導體封裝測試工藝日新月異的變化中發(fā)展壯大，技術得到積累和提升。隨著半導體封裝測試加工向薄，**小

時間：2020-01-05

	      


	      深圳斯普瑞溙科技有限公司是一家**從事半導體后道封裝測試貼片及邦定工藝相關耗材、測試工藝耗材及治具、封裝測試設備備件的研發(fā)設計、生產、銷售于一體的企業(yè)。公司成立于2009年。


	     公司擁有一個半導體制造技術經驗豐富的團隊，不定期地與國外進行技術交流，不斷地進行新技術、新工藝的開發(fā)和改進，使公司在半導體封裝測試工藝日新月異的變化中發(fā)展壯大，技術得到積累和提升。隨著半導體封裝測試加工向**薄，**小的方向發(fā)展，對相關的輔助工裝治具及工藝的要求越來越高，公司通過使用新的材料，研發(fā)設計革新相關輔助治具，提出工藝改進建議，與客戶一起攜手解決遇到的技術難題，使客戶在低成本，**中贏得市場，達到雙贏效果。


	      公司憑借良好的技術團隊，**的產品，準時的交貨，**的客戶服務，合理的價格，已經與諸多的**，國內的IC封裝廠商建立了長期的合作關系，贏得了客戶的認可。


	我們提供的產品及服務如下:


	1)貼片及邦定工藝耗材：陶瓷吸嘴，常溫橡膠吸嘴，高溫橡膠吸嘴，電木吸嘴，引線框架吸嘴，頂針，點膠頭，點膠針，打火桿。


	2）測試工業(yè)耗材及治具：各種封裝系類的測試爪/片（QFN,DFN,SOP,DIP,SOT,SOD,TO-XXX),測試座及POGO PIN,(BGA,QFN,DFN,QFP,FLIP CHIP)


	3)封裝測試設備備件（ISMECA,ASM,ESEC,OE,MUHLBAUER)  


	公司網址/  


	


	  Shenzhen Springtech Technology Co., Ltd ,founded in 2009,is a professional supplier of semiconductor assembly and test tooling parts . Our main areas of focus are die bond , wire bond ,testing processes and the related equipment spare parts . We have our own capability in design , manufacturing and assembly in the various fields of the Semiconductor Industry .  


	


	  Springtech has a team of people with rich experience in semiconductor manufacturing . As a technology company , we recognize the importance of technique and innovation . Therefore we place a high priority in areas of co-operation with overseas partners and embrace new technology , process development moving towards smaller and thinner devices , it is a great challenge for the related manufacturing tools . We are ready to take on these challenges and provide solutions using our core techniques , new materials and process development . In short .we hope to help our customers achieve their targets efficiently with low cost and high quality , enabling all parties to be in a win-win situation .


	   With our continuous efforts to pursue technique innovation , high quality , on-time delivery , customer satisfaction with competitive pricing , we managed to establish long-term co-operation with many IC assembly companies, gaining a soild reputation and recogntion from the industry.


	


	Range of products/services:


	1.Die Bond/Wire Bond tooling:


	 - Ceramic collect tip , rubber tip , high temperature rubber tip , Vespel tip , Lead Frame suction cup , Die ejector needle , Epoxy dispensing nozzles , EFO body .


	2.Testing tools:


	 - (for all package types)Contact Fingers , pogo pin , test socket.


	3.Spare parts :


	 - Machine spare parts for ISMECA , ASM , SRM , ESEC , OE , MUHLBAUER and more.