芯片封裝低溫銀膠

時(shí)間：2022-11-22作者：廣州市銀標(biāo)貿(mào)易有限公司瀏覽：45

IC芯片封裝低溫銀膠

987導(dǎo)電膠是根據(jù)ROHS指令要求設(shè)計(jì)的一種單組份導(dǎo)電膠，它適用于金屬或其他導(dǎo)體材料、半導(dǎo)體器件的導(dǎo)電粘結(jié)及電子線路互聯(lián)，987具有低溫固化之性能，特別適合于無法實(shí)現(xiàn)高溫（>100℃）烘烤的材料粘結(jié)。987導(dǎo)電膠*-40℃冷藏，可室溫（<40℃）貯藏12個(gè)月，使用簡單方便。標(biāo)準(zhǔn)固化條件為30min@80°C。 E104A導(dǎo)電膠是款非溶劑膠，適用于印刷和點(diǎn)膠的方式涂膠。

 

UNCURED PROPERTIES    固化前主要參數(shù)

測試方法

Filler /填料

Silver/銀

 

Viscosity/粘度@ 25°C  (Brookfield CP-51 @ 5 rpm)

30～50 Kcp

ASTM D1084-97

Work Life/施膠時(shí)間 @25°C

> 100 hours

 

Shelf Life/保質(zhì)期   @ <20°C

> 3 months

 

CURE PROCESS固化條件

測試方法

Recommended Condition/推薦固化條件

45 min @90°C

DSC，10K/min

Alternate Condition /其他可選條件

60 min @ 80 °C

 

*The ramp cure was observed to yield reduced voiding and increased strength.

漸進(jìn)升溫可以減少氣泡產(chǎn)生，以及增加強(qiáng)度。

*Higher Temp. or longer curing would increase strength.

提高溫度或延長時(shí)間，可充分固化。

PHYSIOCHEMICAL PROPERTIES-PSOT CURE 固化后物理化學(xué)性質(zhì)

測試方法

Glass Transition Temperature/玻璃轉(zhuǎn)化溫度Tg

113°C

DSC，10K/min

PH / 酸堿度

5.8

 

Coefficient of Thermal Expansion/熱膨脹系數(shù)

Below Tg

56 ppm/°C

 

Volume Conductivity/體積電阻率

< 0.0003Ω.cm

ASTM D257

Thermal Conductivity導(dǎo)熱系數(shù) @ 121°C

30.7 W/mK

ASTM-C518

Shear Strength/ 剪切強(qiáng)度 @ 25°C

> 18Kg/die

ASTM D412

Tensile Strength拉伸強(qiáng)度 @ 25°C

> 2800 psi

ASTM D412


廣州市銀標(biāo)貿(mào)易有限公司專注于PAD天線移印銀漿,導(dǎo)電銀漿,低溫銀膠等

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